PCBA IN AI SMART HOME

With the rapid expansion of the smart home market and the surge in demand, PCBA processing technology also ushered in a new round of innovation and upgrade.

In the process of producing and assembling PCBA for smart home products, some aspects need to be focused on.

• 1. Procurement of components: It is necessary to consider whether the components and design specifications (voltage, current, communication protocols, etc.) are matched, such as frequency bands and protocol support for Wi-Fi/BLE/Zigbee modules.
• 2. PCBA SMT: Attention needs to be paid to stencil openings and reflow profiles to cope with high-density ICs (e.g. QFN packages) and tiny components (below 0402).
• 3. PCBA DIP: Need to pay attention to voltage withstand test and wave soldering shadow effect for electromechanical components (e.g. relays).
• 4. Functional tests must cover wireless RF performance (transmit power/receive sensitivity), multi-protocol interconnect (Matter/HomeKit) and sensor accuracy calibration.

About PCBA Production Parameters:

About PCBA Delivery Time: